Description
Beryllium Aluminum combines the high modulus and low density characteristics of beryllium with the fabrication and mechanical property behaviors of aluminum.
| Compound Formula | BeAl |
|---|---|
| Molecular Weight | 35.99 |
| Appearance | Metallic solid |
| Melting Point | 585 °C |
| Boiling Point | N/A |
| Density | 2.16 g/cm3 |
Typical and custom packaging is available. Primary applications include bearing assembly, ballast, casting, step soldering, and radiation shielding.
Check out these links for more information about Beryllium Aluminum.
US Department of Energy – Beryllium
Beryllium is the only stable light metal with a relatively high melting point. Although it is readily attacked by alkalies and non-oxidizing acids, beryllium rapidly forms an adherent oxide surface film that protects the metal from further air oxidation under normal conditions. These chemical properties make it valuable for structural and thermal applications. Beryllium’s dimensional stability and its ability to take a high polish have made it useful for mirrors and camera shutters in space, military, and medical applications and in semiconductor manufacturing.
Beryllium-Aluminum is also used in the manufacture of computer chips. As electronics sector continues to grow through chip-enabled phones, laptops, tablets, thermostats, home security systems the demand for computer chips is rising sharply.
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